LANDI ELIA

Teaching activities

Completion accademic year: 2024/2025

Course year: 3 First cycle degree (DM 270) INGEGNERIA INFORMATICA E DELL'INFORMAZIONE A.Y. 2022/2023

Completion accademic year: 2023/2024

Course year: 3 First cycle degree (DM 270) COMPUTER AND INFORMATION ENGINEERING A.Y. 2021/2022
Course year: 3 First cycle degree (DM 270) COMPUTER AND INFORMATION ENGINEERING A.Y. 2021/2022

Completion accademic year: 2021/2022

Course year: 1 Second cycle degree (Laurea Magistrale) ELECTRONICS AND COMMUNICATIONS ENGINEERING A.Y. 2021/2022

Completion accademic year: 2020/2021

Course year: 1 Second cycle degree (Laurea Magistrale) ELECTRONICS AND COMMUNICATIONS ENGINEERING A.Y. 2020/2021

Research

Ultime pubblicazioni:

  • Landi, E., Fort, A., Panzardi, E., Cappelli, I., Baldo, D., Mugnaini, M., et al. (2026). A Low-Cost Broadband MEMS Vibration Sensing System with Encapsulated Mounting and Embedded Spectral Feature Extraction for Automotive Applications. In 2026 IEEE International Workshop on Metrology for Automotive (MetroAutomotive) (pp.72-77). New York : IEEE [10.1109/MetroAutomotive69354.2026.11644664]. - view more
  • Panzardi, E., Tani, M., Landi, E., Fort, A., Mugnaini, M., Cappelli, I., et al. (2026). Assessment of Temperature-Profiled MOX Measurements in Multi-Node Mobile IoT Platforms. In 2026 IEEE International Workshop on Metrology for Automotive (MetroAutomotive) (pp.60-65). New York : IEEE [10.1109/MetroAutomotive69354.2026.11644625]. - view more
  • Landi, E., Lisini Baldi, T., Pallaoro, M., Micheletti, F., Carli, F., Fort, A. (2026). Modeling and Design of a Soft Capacitive Slip Sensor with Fluid Dielectric Interlayer. MICROMACHINES, 17(3) [10.3390/mi17030349]. - view more
  • Fort, A., Landi, E., Moretti, R., Mugnaini, M., Vignoli, V. (2026). Optimized Embedded QCM-D System Based on FPGA. IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 75, 1-15 [10.1109/TIM.2026.3674277]. - view more
  • Fort, A., Landi, E., Moretti, R., Mugnaini, M., Vignoli, V. (2025). Effect of the read-out electronics on QCM-D measurements. In 2025 IEEE Sensors Applications Symposium (SAS) (pp.1-6) [10.1109/SAS65169.2025.11105193]. - view more